Description
- Package temperature constraints can severely limit a power device’s performance. Both the performance reliability and life expectancy are inversely related to the device temperature. Shin-Etsu MicroSi’s X23- 7868-2D is an ideal thermal interface material for high performance based platforms
- Shin-Etsu X-23-7868-2D is a high-performance thermal interface material designed for heat management in electronic and mechanical equipment.
- Manufactured under strict quality control, it maintains stable performance in both high and low temperature environments, helping extend equipment service life. It is compatible with various surfaces, including metals, ceramics, and certain engineering plastics, and is widely used in electronic components, power modules, LED lighting, CPU cooling, and mechanical system heat management.
- The 1kg package is ideal for large-scale production and long-term use, providing an efficient and reliable thermal solution for industrial projects.
Technical Information:
- Brand: ShinEtsu | Manufacturer: ShinEtsu
- Appearance: Grey
- Main Filler: Aluminium
- Viscosity (PA*S): 100/680
- Volatile Content after 24 hrs at 150°C (%): 2.8
- Specific Gravity: 2.6
- Thermal Conductivity (W/M*°C) : 3.5 (w/solvent), 6.2 (without solvent)
- Bond Line Thickness (mm): 30
- Thermal Resistance (mm2-K/W): 4.9







