Description
- Shrinking die and increasing power demands continue to make the thermal solution a critical part of IC package design.
- Shin-Etsu MicroSi’s X23- 7783D thermal interface material improves performance by enabling packages to run cooler without sacrificing reliability.
- The ability of X23- 7783D to dissipate heat enables users to reduce the overall cost of their thermal solution.
- Shin-Etsu MicroSi’s X23-7783D is designed to meet current and future thermal management requirements, thus providing drop-in solutions for new IC packages, without the expense of qualifications.
- This highly thermal conductive grease has been successfully used on CPUs, GPUs, PLCs and other temperature sensitive components.
Features:
- Excellent thermal resistance (TR) and thermal conductivity (TC).
- Low viscosity at the time of application, easily applied via dispensing, stencil printing, or screen-printing methods.
- Stable homogeneous mixture for consistent thermal performance RoHS and REACH Compliant.
- High volume production product from a proven industry leader Available worldwide through established supply chain networks.
- This highly thermal conductive grease has been successfully used on CPUs, GPUs, PLCs and other temperature sensitive components.
Technical Information:
- Viscosity @ 25°C (Pascal Second): 170, 200 | Appearance: Gray | Main Filler: Aluminum
- Volatile Content after 24hrs. at 150℃ (%):< 2.6%
- Specific Gravity: 2.6 | Thermal Conductivity(W/m °K): 6.0
- Thermal Conductivity (W/M*°C): 3.5 (w/solvent), 5.7 (without solvent)
- Bond Line Thickness (MM): 72 um
- Thermal Resistance (mm2-K/W): ~7.3 mm2-K/W
Additional Information:
- Brand: Shin-Etsu MicroSi | Manufacturer: Shin-Etsu MicroSi
- Content: 5 0.5gm syringe of X23-7783D (5×0.5 gm) | Includes spreader
- Package dimensions: 17.3 x 11.51 x 2.9 cm; 50 g
View X23-7783D Technical Data sheet
